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Terawatt fab + chip props - #110
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…hbm-stack and chip-package-final briefs
…d unsigned (0.79/0.68/0.59)
…ch, laser ID (0.832, unsigned)
… glass.substrate material, gate 0.822
…wafer stage (0.721, unsigned)
…4 FOUP ports (0.809, unsigned)
…e-clear, gate 0.820 (unsigned)
…ook (0.798, 0.789, unsigned)
… (0.708, 0.764, unsigned)
…, metal.tungsten, oxide.lowk
…wing (unsigned, failing)
… budget, align brief summaries
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Merges terawatt-fab and terawatt-chip lanes. Registry conflicts resolved as unions; swift build clean; CATALOG regenerated.