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FROMLIST: arm64: dts: qcom: hamoa-pmics: Add ADC support#1375

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FROMLIST: arm64: dts: qcom: hamoa-pmics: Add ADC support#1375
raryan-qcom wants to merge 8 commits into
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Add ADC node and define channels for:

  • Die temperature for PMK8550, PM8550VE* and PMC8380* PMICs.
  • PM8550: Die temperature, VPH power, and system thermistors.

Define thermal zones 'sys-0-thermal' through 'sys-6-thermal' which correspond to the off-PMIC system thermistors connected via PM8550 AMUX/GPIO lines.

Also,add io-channels and io-channel-names properties to the temp_alarm nodes so that they can get temperature reading from the ADC die_temp channels.

Link: https://lore.kernel.org/all/20260614-adc5_gen3_dt-v2-4-32ec576c5865@oss.qualcomm.com/

CRs-Fixed: 4559466

jprakash-qc and others added 8 commits June 15, 2026 15:27
…oring

Add support for ADC_TM part of PMIC5 Gen3.

This is an auxiliary driver under the Gen3 ADC driver, which implements the
threshold setting and interrupt generating functionalities of QCOM ADC_TM
drivers, used to support thermal trip points.

Reviewed-by: Jonathan Cameron <jonathan.cameron@huawei.com>
Link: https://lore.kernel.org/all/20260209105438.596339-5-jishnu.prakash@oss.qualcomm.com/
Signed-off-by: Jishnu Prakash <jishnu.prakash@oss.qualcomm.com>
…750 PMICs

On Glymur, Kaanapali, and SM8750, PMIC info is not being properly populated
in qcom_socinfo. Its shows `unknown` as PMIC subtypes are
not updated in the socinfo.

root@glymur-crd:/sys/kernel/debug/qcom_socinfo# cat pmic_model
unknown (92)
root@glymur-crd:/sys/kernel/debug/qcom_socinfo# cat pmic_model_array
unknown (92)
unknown (93)
unknown (98)
unknown (98)
unknown (97)
unknown (97)
unknown (96)
unknown (96)

Update the SUBTYPE info for PMICs present on Glymur,Kaanapali and
SM8750 boards, to fix this issue.

Also, there are some PMIC subtypes present in the socinfo but not
present in the spmi header file, add these entries to keep both definitions
aligned.

Link: https://lore.kernel.org/all/20260507-fury-v1-1-d24e4bb5b774@qti.qualcomm.com/
Signed-off-by: Raj Aryan <raryan@qti.qualcomm.com>
Add macro definitions for virtual channels (combination of ADC channel
number and PMIC SID number), to be used in devicetree by clients of ADC5
GEN3 device and in the "reg" property of ADC channels.

Link: https://lore.kernel.org/all/20260430-adc5_gen3_dt-v1-1-ab2bb40fd490@oss.qualcomm.com/
Signed-off-by: Jishnu Prakash <jishnu.prakash@oss.qualcomm.com>
Add ADC nodes for the four PMM8654au PMICs (pmm8654au_0 through
pmm8654au_3) on the Lemans platform.

Each ADC node exposes the following ADC channels:
- DIE_TEMP: PMIC die temperature channel
- VPH_PWR: Battery/supply voltage channel

Also add the io-channels and io-channel-names properties under
the temp-alarm nodes so that they can get temperature reading
from the ADC die_temp channels.

Link: https://lore.kernel.org/all/20260430-adc5_gen3_dt-v1-2-ab2bb40fd490@oss.qualcomm.com/
Signed-off-by: Ayyagari Ushasreevalli <aushasre@qti.qualcomm.com>
Signed-off-by: Jishnu Prakash <jishnu.prakash@oss.qualcomm.com>
Add ADC nodes for PMM8620AU PMIC instances (SID 0 and SID 2)
present on the Monaco platform.

Each ADC node exposes the following ADC channels:
 - DIE_TEMP: PMIC die temperature channel
 - VPH_PWR: Battery/supply voltage channel

Link: https://lore.kernel.org/all/20260430-adc5_gen3_dt-v1-3-ab2bb40fd490@oss.qualcomm.com/
Signed-off-by: Ayyagari Ushasreevalli <aushasre@qti.qualcomm.com>
Signed-off-by: Jishnu Prakash <jishnu.prakash@oss.qualcomm.com>
Add bindings for the Qualcomm MBG (Master Bandgap) temperature alarm
peripheral found on the PM8775 PMIC. Unlike the existing SPMI temp alarm
peripheral, the MBG peripheral supports both hot and cold thresholdi
monitoring across two programmable levels (LVL1 and LVL2), with interrupt
status reported via a fault status register over SPMI.

Link: https://lore.kernel.org/all/20260601-spmi-mbg-driver-v1-1-b4892b55a17f@oss.qualcomm.com/
Signed-off-by: Satya Priya Kakitapalli <quic_skakitap@quicinc.com>
Co-developed-by: Sachin Gupta <sachin.gupta@oss.qualcomm.com>
Signed-off-by: Sachin Gupta <sachin.gupta@oss.qualcomm.com>
Add driver for the Qualcomm MBG thermal monitoring device. It monitors
the die temperature, and when there is a level 1 upper threshold
violation, it receives an interrupt over spmi. The driver reads
the fault status register and notifies thermal accordingly.

Link: https://lore.kernel.org/all/20260601-spmi-mbg-driver-v1-2-b4892b55a17f@oss.qualcomm.com/
Signed-off-by: Satya Priya Kakitapalli <quic_skakitap@quicinc.com>
Co-developed-by: Sachin Gupta <sachin.gupta@oss.qualcomm.com>
Signed-off-by: Sachin Gupta <sachin.gupta@oss.qualcomm.com>
Add ADC node and define channels for:
- Die temperature for PMK8550, PM8550VE* and PMC8380* PMICs.
- PM8550: Die temperature, VPH power, and system thermistors.

Define thermal zones 'sys-0-thermal' through 'sys-6-thermal' which
correspond to the off-PMIC system thermistors connected via
PM8550 AMUX/GPIO lines.

Also,add io-channels and io-channel-names properties to the
temp_alarm nodes so that they can get temperature reading
from the ADC die_temp channels.

Link: https://lore.kernel.org/all/20260614-adc5_gen3_dt-v2-4-32ec576c5865@oss.qualcomm.com/
Signed-off-by: Ayyagari Ushasreevalli <aushasre@qti.qualcomm.com>
Signed-off-by: Jishnu Prakash <jishnu.prakash@oss.qualcomm.com>
@qcomlnxci qcomlnxci requested review from a team, QUIC-kamalw, jprakash-qc and kotarake and removed request for a team June 18, 2026 07:48
@qlijarvis

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🔨 Build Failure Analysis — PR #1375

PR: #1375
Build run: https://github.com/qualcomm-linux/kernel-config/actions/runs/27744792368

# Error File:Line PR-introduced? Root Cause
1 Merge conflict during automerge drivers/thermal/qcom/Kconfig No Pre-existing conflict in topic branch topic/tech/pmic/misc when merging with baseline
2 Merge conflict during automerge drivers/thermal/qcom/Makefile No Pre-existing conflict in topic branch topic/tech/pmic/misc when merging with baseline

Verdict

No compilation errors exist. The build failed during the pre-build automerge/integration phase due to merge conflicts in files unrelated to this PR. Both conflicts are pre-existing issues in the topic branch, not introduced by PR #1375.

📎 Detailed analysis: Full report

@qlijarvis

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🔨 Build Failure Analysis — PR #1375

PR: #1375
Build run: https://github.com/qualcomm-linux/kernel-config/actions/runs/27744792368

# Error File:Line PR-introduced? Root Cause
1 Merge conflict during integration drivers/thermal/qcom/Kconfig No Pre-existing conflict between topic branch and baseline; PR only modifies DTS file
2 Merge conflict during integration drivers/thermal/qcom/Makefile No Pre-existing conflict between topic branch and baseline; PR only modifies DTS file

Verdict

No compilation errors occurred. The build failed during the merge/integration phase with conflicts in drivers/thermal/qcom/Kconfig and drivers/thermal/qcom/Makefile. These conflicts are not introduced by this PR — the PR only modifies arch/arm64/boot/dts/qcom/hamoa-pmics.dtsi. The conflicts exist between other commits in the topic branch (topic/tech/pmic/misc) and the baseline integration branch.

📎 Detailed analysis: Full report

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4 participants